L'accouplement de Weil entre le sous-groupe de Shimura et le sous-groupe cuspidal de J [...] (p).

Loic Merel

Journal für die reine und angewandte Mathematik (1996)

  • Volume: 477, page 71-116
  • ISSN: 0075-4102; 1435-5345/e

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Merel, Loic. "L'accouplement de Weil entre le sous-groupe de Shimura et le sous-groupe cuspidal de J [...] (p).." Journal für die reine und angewandte Mathematik 477 (1996): 71-116. <http://eudml.org/doc/153839>.

@article{Merel1996,
author = {Merel, Loic},
journal = {Journal für die reine und angewandte Mathematik},
keywords = {modular curves; Eisenstein ideals; Weil pairing; Jacobian varieties; Shimura subgroup; cuspidal subgroup},
language = {fre},
pages = {71-116},
title = {L'accouplement de Weil entre le sous-groupe de Shimura et le sous-groupe cuspidal de J [...] (p).},
url = {http://eudml.org/doc/153839},
volume = {477},
year = {1996},
}

TY - JOUR
AU - Merel, Loic
TI - L'accouplement de Weil entre le sous-groupe de Shimura et le sous-groupe cuspidal de J [...] (p).
JO - Journal für die reine und angewandte Mathematik
PY - 1996
VL - 477
SP - 71
EP - 116
LA - fre
KW - modular curves; Eisenstein ideals; Weil pairing; Jacobian varieties; Shimura subgroup; cuspidal subgroup
UR - http://eudml.org/doc/153839
ER -

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